金磊，男，1995年4月生，重庆涪陵人，九三学社社员，理学博士，硕士生导师，涪陵区社会科学界联合会智库专家。
研究领域为集成电路电子电镀/化学镀、绿色金属和合金电镀、电解铜箔制备和金属湿法蚀刻等。主持国家自然科学基金青年基金项目、重庆市教委青年项目、企业委托项目等。在ACS Sustainable Chemistry & Engineering、Electrochimica Acta、Materials Today Communications等期刊上发表SCI论文40余篇，授权中国专利4项；主编著作《机械设计原理与制造工艺》，参编著作《电化学测量原理和方法》。荣获第二十一次全国电化学大会优秀口头报告奖。担任核心期刊《电镀与涂饰》、《铜业工程》青年编委；担任《Applied Surface Science》、《Electrochimica Acta》、《Surfaces and Interfaces》、《Journal of Alloys and Compounds》等SCI期刊审稿人。
承担本科生《新能源材料与器件专业导论》、《应用电化学》、《材料分析检测技术》，研究生《材料与化工现代研究方法》等课程，主持教育部产学合作协同育人项目、校级教改重点项目、核心课程建设项目；主编教材《新能源材料与器件导论》。
联系邮箱：leijin@yznu.edu.cn
学习及工作经历：
2013.09-2017.06，东北师范大学，化学学院，化学，学士
2017.09-2023.06，厦门大学，化学化工学院，物理化学（电化学），博士
2022.11-2023.01，华为中央研究院瓦特实验室
2023.07-至今，长江师范学院，材料科学与工程学院，讲师
主持的主要科研项目（不超过20项）：
（1）国家自然科学基金委员会，青年科学基金项目（C类）（22502016），2026.01-2028.12；
（2）重庆市教育委员会，青年项目（KJQN202501432），2025.07-2028.06；
（3）重庆市教育委员会，青年项目（KJQN202401423），2024.10-2027.10；
（4）企业（重庆立道新材料科技有限公司）委托项目，2024.08-2025.07；
（5）企业（电子科技大学）委托项目，2025.04-2027.03；
（6）长江师范学院人才引进科研启动项目，2023.07-
主研和参与的科研项目：
（1）国家自然科学基金委员会，重点项目（22132003），2022.01-2026.12；
（2）国家自然科学基金委员会，面上项目（21972118），2020.01-2023.12；
（3） 重庆市科学技术局，面上项目（2024NSCQ-MSX094），2024.06-2027.05；
（4）重庆市教育委员会，重点项目（KJZD-K20240140），2024.10-2027.10；
（5）企业（华为技术有限公司）委托项目，2021.07-2023.07；
（6）企业（深圳顺络电子股份有限公司）委托项目，2021.01-2023.12；
（7）企业（南通群安电子材料有限公司）委托项目，2022.09-2025.10
代表性论文、专利、专著、奖励（不超过20篇）：
1. Lei Jin*, Tao Song, Zhong-Yuan Shi, Rong-An Bao, Fang-Zu Yang. Study on the structural properties of an imidazole derivative synthesized based on the schiff base reaction and its effects as a leveler on microvia copper electroplating. Journal of Electroanalytical Chemistry, 2025, 998, 119543.
2. Lei Jin*, Zhao-Yun Wang, Fang-Zu Yang. Cobalt Electroplating Interconnects in Advanced Chip Fabrication: A Review. Journal of Electronic Materials, 2025, 54, 8166-8184.
3. Lei Jin*, Ke Li, Zhao-Yun Wang. Effects of 2-aminothiazoline and benzotriazole on copper foil etching. Transactions of The Institute of Metal Finishing, 2025, 103(3), 125-130.
4. Lei Jin*, Yu-Jie Lv, Ting-Ting Ran, Die He, Fang-Zu Yang. Molecular structure with adsorption behavior of butynediol and its effects on cobalt electrodeposition. Materials Today Communications, 2025, 45, 112225.
5. Lei Jin*, Ke Li, Zhao-Yun Wang, Xin Chen. Electrochemical and theoretical studies for forward understanding the mechanism and the synergistic effects of accelerating ions in copper foil etching. Materials Today Communications, 2025, 42, 111483.
6. Lei Jin*, Jia-Yao Guo, Miao-Miao Cui, Fang-Zu Yang*, Dongping Zhan. Phase transformation sequence of amorphous nickel-molybdenum electrodeposit. Materials Today Communications, 2024, 39, 108863.
7. Lei Jin*, Zhao-Yun Wang, Fang-Zu Yang, Dongping Zhan. Influence Mechanism of Synergistic Additives on the Nucleation and Coating Morphology and Structure of Copper Electronic Plating. CHEMICAL JOURNAL OF CHINESE UNIVERSITIES, 2024, 45(8), 20240146.
8. Lei Jin, Jia-Qiang Yang, Yi Zhao, Zhao-Yun Wang, Si-Yu Chen, An-Ni Zheng, Tao Song, Fang-Zu Yang*, Dongping Zhan*. Instrumental methodologies of electronic electroplating towards the integrated circuit industry. SCIENTIA SINICA Chimica, 2023, 53, 1-132
9. Lei Jin, Zhi-Hao Liang, Jia-Qiang Yang, An-Ni Zheng, Zhao-Yun Wang, Fang-Zu Yang*, De-Yin Wu*, Zhong-Qun Tian and Dongping Zhan*. Insights into the DMH tautomeric structures and its effects on the electro-reduction of Au(DMH)4− coordination ions. Electrochimica Acta, 2023, 437, 141494.
10. Lei Jin, Zhao-Yun Wang, Zhuan-Yun Cai, Jia-Qiang Yang, An-Ni Zheng, Fang-Zu Yang*, Dongping Zhan*, De-Yin Wu and Zhong-Qun Tian. 1-(2-Pyridylazo)-2-naphthol as a Multi-functional Additive for Improving Throwing Power of Through-Hole Copper Electronic Electroplating. Journal of Industrial and Engineering Chemistry, 2023, 125, 269-276.
11. Lei Jin, An-Ni Zheng, Mei Wang, Jia-Qiang Yang, Zhao-Yun Wang, Fang-Zu Yang*, Dongping Zhan*, De-Yin Wu and Zhong-Qun Tian. Insights into the effects of safranine as a multifunctional additive in acidic sulfate copper electronic electroplating bath for high-quality electronics interconnection. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2023, 671, 131706.
12. Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Jia-Qiang Yang, An-Ni Zheng, Fang-Zu Yang*, Dongping Zhan*, De-Yin Wu and Zhong-Qun Tian. Novel, Simple, and Green Citrate-Based Copper Electronic Electroplating Bath in Microvia Void-Free Filling for Printed Circuit Board Application. ACS Sustainable Chemistry & Engineering, 2022, 10, 14204-14211.
13. Lei Jin, Jia-Qiang Yang, Fang-Zu Yang*, Dongping Zhan, De-Yin Wu and Zhong-Qun Tian. Novel and Green Chemical Compound of HAu(Cys)2: Toward a Simple and Sustainable Electrolyte Recipe for Cyanide-Free Gold Electrodeposition. ACS Sustainable Chemistry & Engineering, 2020, 8, 38, 14274-14279.
14. Lei Jin, Jia-Qiang Yang, Fang-Zu Yang*, De-Yin Wu* and Zhong-Qun Tian. Electrochemistry and Coordination Behaviors of Hypoxanthine-Au(III) Ion in the Cyanide-Free Gold Electrodeposition. Journal of the Electrochemical Society, 2020, 167, 022511.
15. Lei Jin, Cheng Liu, Fang-Zu Yang*, De-Yin Wu* and Zhong-Qun Tian. Coordination behavior of theophylline with Au(III) and electrochemical reduction of the complex. Electrochimica Acta, 2019, 304, 168-174.
16. 金磊, 杨家强, 杨防祖*, 詹东平*, 田中群, 周绍民. 芯片铜互连研究及进展. 电化学, 2020, 26(4): 521-530.
